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1. Applications and Challenges of AI in PCB X-ray Inspection: A Comprehensive Study NSTL国家科技图书文献中心

ANTIKA ROY |  MD MAHFUZ AL HASAN... -  《ACM Journal on Emerging Technologies in Computing Systems》 - 2025,21(1) - 1～ - 共28页

摘要：As printed circuit boards (PCBs) continue to evolve in complexity and miniaturization, the demand for robust and efficient inspection techniques has become paramount in ensuring the quality and reliab...
关键词： Deep learning |  Convolutional neural networks |  Synthetic image generation |  Generative adversarial networks |  Dimensionality reduction |  Netlist extraction |  Advancedr packaging |  Reconstruction |  Iterative reconstruction
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2. Advancing PCB Assurance Towards Netlist Extraction with the Integration of X-Ray Imaging and Semi-Supervised Learning Techniques NSTL国家科技图书文献中心

Patrick Craig |  Antika Roy... -  《2024 IEEE Research and Applications of Photonics in Defense Conference》 -  IEEE Research and Applications of Photonics in Defense Conference - 2024, - 1～2 - 共2页

摘要：PCBs are indispensable components that enable the functionality of modern electronics across numerous industries. This study presents a framework for their semi-supervised netlist extraction by addres...
关键词： Industries |  Annotations |  X-ray tomography |  Semisupervised learning |  Artificial intelligence |  X-ray imaging |  Photonics
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3. Physical Assurance for Photonics Devices NSTL国家科技图书文献中心

Liton Kumar Biswas |  Nitin Varshney... -  《Photonic Instrumentation Engineering XI: At SPIE OPTO.29-31 January 2024.San Francisco, California, United States》 -  Photonic Instrumentation Engineering (conference) - 2024, - 1289315.1～1289315.9 - 共9页

摘要：Photonics' potential has changed various industries. Device and system security is important as photonics technology advances. Physical risks and photonics asset protection are examined in this work. ...
关键词： Silicon photonics (SiPH) |  Security vulnerabilities in supply chain |  Physical inspection
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4. THz-TDS for IC Packaging Material Changes Detection Under Real-world Conditions NSTL国家科技图书文献中心

Chengjie Xi |  Nitin Varshney... -  《Terahertz, RF, Millimeter, and Submillimeter-Wave Technology and Applications XVII: At SPIE OPTO.29 January - 1 February 2024.San Francisco, California, United States》 -  Terahertz, RF, Millimeter, and Submillimeter-Wave Technology and Applications (conference) - 2024, - 128850B.1～128850B.9 - 共9页

摘要：Hardware security has been a significant challenge in semiconductor devices, leading to serious issues such as denial of service, data leakage etc at both transistor as well as package level. Detectin...
关键词： THz-TDS |  Hardware assurance |  Advanced packaging |  Epoxy molding compound
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5. Enhancing Counterfeit Detection of Integrated Circuits through Machine Learning-assisted THz-TDS Analysis NSTL国家科技图书文献中心

Chengjie Xi |  Nitin Varshney... -  《Terahertz, RF, Millimeter, and Submillimeter-Wave Technology and Applications XVII: At SPIE OPTO.29 January - 1 February 2024.San Francisco, California, United States》 -  Terahertz, RF, Millimeter, and Submillimeter-Wave Technology and Applications (conference) - 2024, - 128850C.1～128850C.9 - 共9页

摘要：Due to the global offshore fabrication of semiconductors, hardware security problems such as counterfeit ICs and Hardware Trojans (HTs) have affected semiconductor device trustworthiness in critical a...
关键词： THz-TDS |  Hardware assurance |  Advanced packaging |  Machine learning |  Counterfeit detection
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6. Demystifying Edge Cases in Advanced IC Packaging Inspection through Novel Explainable AI Metrics NSTL国家科技图书文献中心

Shajib Ghosh |  Antika Roy... -  《2024 IEEE 74th Electronic Components and Technology Conference: ECTC 2024, Denver, Colorado, USA, 28-31 May 2024, [v.1]》 -  IEEE Electronic Components and Technology Conference - 2024, - 2286～2293 - 共8页

摘要：Inspecting advanced packaging systems for integrated circuits presents difficulties due to the intricacy of contemporary semiconductor packages, which include small dimensions, dense structures, and d...
关键词： Semiconductor device measurement |  Explainable AI |  Image edge detection |  Decision making |  Electronic components |  Packaging |  Inspection
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7. Multi-Modal Printed Circuit Board Netlist Extraction With X-ray and Optical Imaging NSTL国家科技图书文献中心

Patrick Craig |  Nitin Varshney... -  《Developments in X-Ray Tomography XV》 -  Developments in X-Ray Tomography (conference) - 2024, - 131520Q.1～131520Q.5 - 共5页

摘要：Printed circuit boards (PCBs) are indispensable components that enable the functionality of modern electronics applications. Ranging from various densities and uniqueness by design, the attack surface...
关键词： Machine learning |  Printed circuit board |  Netlist |  Segmentation |  X-ray |  Optical |  Microscopy
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8. Challenges and opportunities in non-destructive characterization of stacked IC packaging: Insights from SAM and 3D X-ray analysis NSTL国家科技图书文献中心

Nitin Varshney |  Shajib Ghosh... -  《Developments in X-Ray Tomography XV》 -  Developments in X-Ray Tomography (conference) - 2024, - 1315225.1～1315225.8 - 共8页

摘要：This study scrutinizes the limitations and challenges of applying non-destructive techniques such as Scanning Acoustic Microscopy (SAM) and 3D X-ray imaging for testing 3D and 2.5D integrated circuit ...
关键词： X-Ray tomography |  Scanning acoustic microscopy |  Characterization |  Non-destructive techniques |  Stacked IC packaging |  Failure analysis
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9. Silicon Photonics Under Siege: Unveiling Security Vulnerabilities Against SAW NSTL国家科技图书文献中心

Liton Kumar Biswas |  Rouhan Noor... -  《2024 IEEE Research and Applications of Photonics in Defense Conference》 -  IEEE Research and Applications of Photonics in Defense Conference - 2024, - 1～2 - 共2页

摘要：The paper investigates challenges posed by acoustic wave interference on silicon photonic devices, explicitly focusing on MEMS and LiDAR systems. This study explores the impacts of ultrasound interfer...
关键词： Micromechanical devices |  Laser radar |  Ultrasonic imaging |  Surface acoustic waves |  Interference |  Surface acoustic wave devices |  Inspection
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10. Motivating automated multimodal failure analysis for heterogeneously integrated devices NSTL国家科技图书文献中心

Patrick Craig |  Nitin Varshney... -  《Developments in X-Ray Tomography XV》 -  Developments in X-Ray Tomography (conference) - 2024, - 1315228.1～1315228.6 - 共6页

摘要：The semiconductor industry's advancements in advanced packaging and heterogeneous integration have outpaced traditional failure analysis and quality assurance capabilities. Existing non-destructive ch...
关键词： Advanced packaging |  Heterogeneous integration |  X- ray imaging |  Scanning acoustic microscopy |  Reliability
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